Substrate-free tape

High viscosity, high temperature resistance, used for general industrial assembly, panel punching and its bonding, FPC fixation, foam back adhesive, etc. In addition, our company also has non-base material tapes which are specially applicable to LVOC requ
Description
Thickness specification: 0.06mm-0.13mm

(in addition, there is no substrate tape with fiber grid enhancement, which can meet the specific application requirements of customers.)

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